MediaTek, the global fabless semiconductor company, is showcasing its range of Wi-Fi 7 devices at CES 2023. These devices, which include residential gateways, mesh routers, televisions, smartphones and laptops, are the first of their kind and represent the culmination of MediaTek’s investment in Wi-Fi 7 technology.
“Last year, we gave the world’s first Wi-Fi 7 technology demonstration, and we are honored to now show the significant progress we have made in building a more complete ecosystem of products,” said Alan Hsu, corporate vice president and general manager of the Intelligent Connectivity Business unit at MediaTek. “This lineup of devices, many of which are powered by the CES 2023 Innovation Award-winning Filogic 880 flagship chipset, illustrates our commitment to providing the best wireless connectivity.
Wi-Fi 7, which offers significant improvements over Wi-Fi6 and 6E, is the most advanced Wi-Fi standard to date, offering a record-breaking 320MHz channel bandwidth and 4096-QAM modulation to improve user experience. It also includes Multi-Link Operation (MLO), which allows the Wi-Fi connection to aggregate channel speeds in congested environments.
“We are excited to collaborate with MediaTek on the latest Wi-Fi 7 technology. Fast and reliable wireless connectivity is crucial for consumers, and we believe that combining powerful AMD Ryzen processors with MediaTek’s advanced connectivity technologies will deliver an excellent user experience,” said Jason Banta, corporate vice president and general manager, client OEM at AMD.
MediaTek’s Wi-Fi 7 solution also uses a 6nm process, resulting in a 50% reduction in main power consumption, 25x reduction in CPU utilization and 100x lower MLO switch latency compared to competing options.
The company’s Filogic chips will also be on display, with the Filogic 880 providing Wi-Fi 7 access point technology to broadband operators, retail router channels and enterprise markets, and the Filogic 380 bringing Wi-Fi 7 connectivity to client devices like smartphones and tablets.
