MediaTek has unveiled the Dimensity 8300, a cutting-edge, power-efficient chipset meticulously crafted for the next era of premium 5G smartphones. Positioned as the latest addition to the highly acclaimed Dimensity 8000 lineup, the Dimensity 8300 is poised to redefine the landscape with its generative AI capabilities, energy-efficient design, adaptive gaming prowess, and rapid connectivity, offering users an unparalleled flagship-level experience.
Built on TSMC’s 2nd generation 4nm process, the Dimensity 8300 boasts an octa-core CPU featuring four Arm Cortex-A715 cores and four Cortex-A510 cores, embodying Arm’s latest v9 CPU architecture. This robust core configuration propels the Dimensity 8300 to deliver a stellar 20% boost in CPU performance and an impressive 30% peak gain in power efficiency compared to its predecessor. The Mali-G615 MC6 GPU upgrade further enhances the chipset’s capabilities, providing an astounding 60% increase in performance and a remarkable 55% improvement in power efficiency. The result is a seamlessly smooth experience across gaming, lifestyle applications, photography, and more.
Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business Unit, expressed, “With MediaTek’s optimised Dimensity 8000 series, consumers don’t have to compromise on accessibility for premier experiences. The Dimensity 8300 unlocks new possibilities for the premium smartphone segment, offering users in-hand AI, hyper-realistic entertainment opportunities, and seamless connectivity without sacrificing efficiency.”
The Dimensity 8300 proudly stands as the pioneer premium-tier System on a Chip (SoC) equipped with full generative AI support, thanks to the integration of the APU 780 AI processor. This revolutionary addition empowers developers to create innovative applications harnessing large language models (LLMs) up to 10 billion, with stable diffusion. Featuring the same architecture as the flagship Dimensity 9300 SoC, the APU 780 delivers a 2x improvement in INT and FP16 computation and an astonishing 3.3x boost in AI performance over the Dimensity 8200.
The chipset’s advanced AI capabilities, coupled with MediaTek’s 14-bit HDR-ISP Imagiq 980, usher in a new era for premium smartphone photography and video capturing. Users can anticipate capturing sharper, clearer videos at 4K60 HDR and extended recording times, courtesy of the Dimensity 8300’s exceptionally power-efficient design.
To optimise battery life further, MediaTek introduces the next generation of HyperEngine adaptive game technology, offering advanced power-saving enhancements. This intelligent technology adapts to computing demands, monitors device temperature, and ensures optimised gameplay, allowing users to enjoy full FPS, low lag, and seamless rendering while keeping devices cool.
In the realm of connectivity, the Dimensity 8300 supports ultra-fast speeds through its built-in 3GPP Release-16 standard 5G modem. Scenario-specific optimisations enhance connectivity in environments with weaker connections, amplifying sub-6GHz performance and range for a more reliable user experience. The modem supports 3CC carrier aggregation, delivering up to 5.17Gbps downlink speeds.
Key features of the MediaTek Dimensity 8300 include LP5x 8533Mbps and uFS4.0 MCQ memory, providing a 33% speed boost on LPDDR and up to 100% faster R/W to flash compared to its predecessor. MediaTek 5G UltraSave 3.0+ improves 5G power efficiency by up to 20% in daily usage scenarios, while upgraded Wi-Fi 6E performance with 160 MHz bandwidth ensures seamless collaboration between peripherals like earbuds, wireless gamepads, and more.
With the Dimensity 8300 set to power 5G devices globally by the end of 2023, MediaTek continues to push the boundaries of innovation, offering consumers an unmatched blend of performance, efficiency, and cutting-edge technology. To explore MediaTek’s Dimensity portfolio, visit: https://i.mediatek.com/mediatek-5g.
